Micron breaks ground on $24 billion Singapore fab aimed at AI-driven memory demand
Micron says it has started construction on a new advanced wafer fabrication facility in Singapore as part of a long-term investment plan focused on meeting demand for NAND technology fueled by AI and data-centric computing. The company set an initial production target for the second half of 2028 and described major capacity, sustainability and workforce plans tied to the project.
Micron Technology said it has broken ground on a new advanced wafer fabrication facility in Singapore, describing the project as a planned investment of about $24 billion over 10 years. The company positioned the expansion as a long-horizon bet on demand for memory and storage driven by AI and data-centric applications. ([investors.micron.com](https://investors.micron.com/news-releases/news-release-details/micron-breaks-ground-advanced-wafer-fabrication-facility))
What Micron says it is building
In its announcement, Micron said the facility will be located within its existing NAND manufacturing complex in Singapore and is designed to ultimately provide 700,000 square feet of cleanroom space. The company said wafer output is scheduled to begin in the second half of calendar 2028. ([investors.micron.com](https://investors.micron.com/news-releases/news-release-details/micron-breaks-ground-advanced-wafer-fabrication-facility))
Why Singapore, and why now
Micron framed the project as part of its strategy to support technology transitions and long-term supply requirements, arguing that colocating manufacturing and R&D can improve efficiency and speed time-to-market. The company also highlighted Singapore’s role as a manufacturing hub and described the build as Singapore’s first double-story wafer manufacturing fab. ([investors.micron.com](https://investors.micron.com/news-releases/news-release-details/micron-breaks-ground-advanced-wafer-fabrication-facility))
Jobs, sustainability, and adjacent capacity
Micron said the investment will create around 1,600 jobs, and it noted that an additional high-bandwidth memory (HBM) advanced packaging facility at the same site is on track to contribute meaningfully to HBM supply in calendar 2027. It also said the new fab will align with sustainability commitments and recognized standards (including LEED-related practices). ([globenewswire.com](https://www.globenewswire.com/news-release/2026/01/27/3226056/14450/en/Micron-Breaks-Ground-on-Advanced-Wafer-Fabrication-Facility-in-Singapore.html?utm_source=openai))
For the broader tech sector, the announcement served as another signal that memory makers are planning multi-year capacity and capability upgrades in response to AI workloads, which are increasing demand for both storage and advanced memory across data centers and edge devices. ([investors.micron.com](https://investors.micron.com/news-releases/news-release-details/micron-breaks-ground-advanced-wafer-fabrication-facility))